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Home » Product List » Dicing Blades » Ultra Thin & Precision Cutting Wheels
Product Details
Ultra Thin & Precision Cutting Wheels
| Model NO.: | 1A1R, 1A8 |
|---|---|
| Productivity: | 30000 PCS/Month |
| Unit Price: | US $ 60/ Piece |
| Shipment Terms: | FOB |
| Payment Terms: | T/T,Western Union |
| Minimum Order: | 100 Pieces |
| Price Valid Time: | From Dec 11,2011 To Dec 03,2012 |
| HS Code: | 68042210 |
| Trademark: | BONDFLEX, SAILI, SUMENG |
| Origin: | Jiangsu China |
| Material: | Diamond |
| Type: | Grinding Machine |
| Export Markets: | North America, Eastern Europe, Southeast Asia, Western Europe |
Diamond / CBN blades for the precision cutting of wafer, magnetic head, IC, LSI, optical biber etc.Resin, metal and electroformed bonds
Our factory is a world leader in the development and manufacturer of dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation.
Nickel-bond Dicing Blades
The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as:PCB, Silicon and BGA
Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size)
Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness)
Resin-bond Dicing Blades
Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as:QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)
Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness).
