• Eletroformed Hubless Dicing Blades
  • Eletroformed Hubless Dicing Blades
  • Eletroformed Hubless Dicing Blades
  • Eletroformed Hubless Dicing Blades
  • Eletroformed Hubless Dicing Blades
  • Eletroformed Hubless Dicing Blades

Eletroformed Hubless Dicing Blades

Manufacturing Technology: Logic IC
Material: Element Semiconductor
Type: Intrinsic Semiconductor
Package: PGA(Pin Grid Array Package)
Signal Processing: Analog Digital Composite and Function
Application: Refrigerator
Customization:

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Mr. Zhou Rong Ping
Vice President of Operations
Gold Member Since 2006

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Rating: 3.0/5
Manufacturer/Factory

Basic Info.

Model NO.
1A1R
Model
ST
Batch Number
2010+
Brand
EPSON
Transport Package
by Plastic
Trademark
SAIL
Origin
Suzhou
HS Code
6804221000

Product Description

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor.
Eletroformed Hubless Dicing Blades Eletroformed Hubless Dicing Blades Eletroformed Hubless Dicing Blades Eletroformed Hubless Dicing Blades Eletroformed Hubless Dicing Blades
The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor.

Also the products are used for the precision processing of hard and fragile materials, such as quartz, glass, ceramics, etc.

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