Jiangsu, China
Business Type:
Manufacturer/Factory
Registered Capital:
8000000 RMB
Plant Area:
>2000 square meters
Management System Certification:
ISO 9001, ISO 14001, ISO 14000, OHSAS/ OHSMS 18001
Average Lead Time:
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
OEM/ODM Service
Sample Available
Rating:
3.0/5

Abrasives, Grinding Wheel, Diamond Wheel manufacturer / supplier in China, offering Superabrasives, Diamond, CBN, and CDX Grinding Wheels, Resin Bond Diamond Wheels, Phenolic and Polyimide. Double Side Grinding Discs, Diamond and CBN Wheels, Flute Grinding, Clearance and Face Surface Grinding, Profile Grinding and so on.

Gold Member Since 2006

Suppliers with verified business licenses

Dicing Blades

Total 12 Dicing Blades Products

Wafer Back & Front Wheels

Min. Order: 500 Pieces
Manufacturing Technology: Optoelectronic Semiconductor
Material: Element Semiconductor
Type: Intrinsic Semiconductor
Package: SMD
Signal Processing: Analog Digital Composite and Function
Application: Temperature Measurement

1A8 Metal Bond Cutting Blades

Min. Order: 500 Pieces
Manufacturing Technology: Logic IC
Material: Element Semiconductor
Type: Intrinsic Semiconductor
Package: PGA(Pin Grid Array Package)
Signal Processing: Analog Digital Composite and Function
Application: Refrigerator

Eletroformed Hubless Dicing Blades

Min. Order: 500 Pieces
Manufacturing Technology: Logic IC
Material: Element Semiconductor
Type: Intrinsic Semiconductor
Package: PGA(Pin Grid Array Package)
Signal Processing: Analog Digital Composite and Function
Application: Refrigerator

Eletroformed Dicing Blades with Hub

Min. Order: 500 Pieces
Manufacturing Technology: Optoelectronic Semiconductor
Material: Element Semiconductor
Type: Intrinsic Semiconductor
Package: PGA(Pin Grid Array Package)
Signal Processing: Analog Digital Composite and Function
Application: Temperature Measurement

Diamond Blades with Cores

Min. Order: 500 Pieces
Manufacturing Technology: Discrete Device
Material: Element Semiconductor
Type: Intrinsic Semiconductor
Package: PGA(Pin Grid Array Package)
Signal Processing: Analog Digital Composite and Function
Application: Temperature Measurement

1A8 Resin Bond Diamond Blades

Min. Order: 500 Pieces
Manufacturing Technology: Logic IC
Material: Element Semiconductor
Type: N-type Semiconductor
Package: PGA(Pin Grid Array Package)
Signal Processing: Digital
Application: Temperature Measurement

Nickel, Metal, Resin Bond Dicing Blade (1A8, 1A1 and 1A1R)

FOB Price: US $54 / Piece
Min. Order: 100 Pieces
Material: Diamond
Abrasive: Superabrasive
Shapes: Section Shape
Types: Cutting Wheel
Grain Size: 120#
Cylindricity: <1

Metal Bonded Dicing Blades, Superabrasives

FOB Price: US $58 / Piece
Min. Order: 100 Pieces
Material: Diamond
Abrasive: Superabrasive
Shapes: Edge Shape
Types: Cutting Wheel
Grain Size: 240#
Cylindricity: <1

Resin Bonded Dicing Blade

FOB Price: US $66 / Piece
Min. Order: 100 Pieces
Material: Diamond
Abrasive: Superabrasive
Shapes: Edge Shape
Types: Cutting Wheel
Grain Size: 80#
Cylindricity: <0.5

Diamond Dicing Blades

FOB Price: US $80 / Piece
Min. Order: 100 Pieces
Trademark: BONDFLEX, SAILI, SUMENG
Origin: Jiangsu China

Ultra Thin / Ultra Precision Diamond Discs, Grinding Wheel, Cylindrical Grinding, Profile and Cutoff Grinding

FOB Price: US $28 / Piece
Min. Order: 1,000 Pieces
Material: Diamond
Abrasive: Superabrasive
Shapes: Section Shape
Types: Cutting Wheel
Grain Size: 150#
Cylindricity: <1

Ultra Thin & Precision Cutting Wheels

FOB Price: US $60 / Piece
Min. Order: 100 Pieces
Material: Diamond
Abrasive: Superabrasive
Shapes: Section Shape
Types: Cutting Wheel
Grain Size: 280#
Cylindricity: <0.5