• 1A8 Resin Bond Diamond Blades
  • 1A8 Resin Bond Diamond Blades
  • 1A8 Resin Bond Diamond Blades
  • 1A8 Resin Bond Diamond Blades
  • 1A8 Resin Bond Diamond Blades
  • 1A8 Resin Bond Diamond Blades

1A8 Resin Bond Diamond Blades

Manufacturing Technology: Logic IC
Material: Element Semiconductor
Type: N-type Semiconductor
Package: PGA(Pin Grid Array Package)
Signal Processing: Digital
Application: Temperature Measurement
Customization:

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Mr. Zhou Rong Ping
Vice President of Operations
Gold Member Since 2006

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Rating: 3.0/5
Manufacturer/Factory

Basic Info.

Model NO.
1A1, 1A1R, 1A8
Model
PC817
Batch Number
2007+
Trademark
SAIL
Origin
Suzhou
HS Code
6804221000

Product Description

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor.
1A8 Resin Bond Diamond Blades 1A8 Resin Bond Diamond Blades 1A8 Resin Bond Diamond Blades 1A8 Resin Bond Diamond Blades 1A8 Resin Bond Diamond Blades
The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor.

Also the products are used for the precision processing of hard and fragile materials, such as quartz, glass, ceramics, etc.

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