1A8 Metal Bond Cutting Blades

• Manufacturing Technology: Logic IC
• Material: Element Semiconductor
• Type: Intrinsic Semiconductor
• Package: PGA(Pin Grid Array Package)
• Signal Processing: Analog Digital Composite and Function
• Application: Refrigerator
• Model NO.: 1A1R
• Model: PC817
• Batch Number: 2007+
• Trademark: SAIL
• Origin: Suzhou
• HS Code: 6804221000

Product Description

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor.

The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor.

Also the products are used for the precision processing of hard and fragile materials, such as quartz, glass, ceramics, etc.