Ultra Thin / Ultra Precision Diamond Discs, Grinding Wheel, Cylindrical Grinding, Profile and Cutoff Grinding

Product Details
Customization: Available
Material: Diamond
Abrasive: Superabrasive
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Registered Capital
8000000 RMB
Plant Area
>2000 square meters
  • Ultra Thin / Ultra Precision Diamond Discs, Grinding Wheel, Cylindrical Grinding, Profile and Cutoff Grinding
  • Ultra Thin / Ultra Precision Diamond Discs, Grinding Wheel, Cylindrical Grinding, Profile and Cutoff Grinding
  • Ultra Thin / Ultra Precision Diamond Discs, Grinding Wheel, Cylindrical Grinding, Profile and Cutoff Grinding
  • Ultra Thin / Ultra Precision Diamond Discs, Grinding Wheel, Cylindrical Grinding, Profile and Cutoff Grinding
  • Ultra Thin / Ultra Precision Diamond Discs, Grinding Wheel, Cylindrical Grinding, Profile and Cutoff Grinding
  • Ultra Thin / Ultra Precision Diamond Discs, Grinding Wheel, Cylindrical Grinding, Profile and Cutoff Grinding
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Basic Info.

Model NO.
1A1R, 1A8
Shapes
Section Shape
Types
Cutting Wheel
Grain Size
150#
Cylindricity
<1
Circular Degree
<1
Technics
Electroplating
Working Style
Cutting
Trademark
SAILI, RENMIN, BONDFLEX
Origin
Jiangsu
HS Code
68042210
Production Capacity
25000 pieces/day

Product Description

We produce Ultra Precision diamond and CBN grinding wheel
Ultra Thin / Ultra Precision Diamond Discs, Grinding Wheel, Cylindrical Grinding, Profile and Cutoff GrindingUltra Thin / Ultra Precision Diamond Discs, Grinding Wheel, Cylindrical Grinding, Profile and Cutoff GrindingUltra Thin / Ultra Precision Diamond Discs, Grinding Wheel, Cylindrical Grinding, Profile and Cutoff GrindingUltra Thin / Ultra Precision Diamond Discs, Grinding Wheel, Cylindrical Grinding, Profile and Cutoff GrindingUltra Thin / Ultra Precision Diamond Discs, Grinding Wheel, Cylindrical Grinding, Profile and Cutoff Grinding
Application:
They are suitable for: High-tech electronic parts and related products such as magnetic head, IC, LSI, optical fiber, semiconductor, electronic lead frame and etc, require high precision disc wheel with high precision, efficiency Cutting, Slicing, Wafering, Grooving, Slotting, Cross Sectioning, Gang Sawing, Slabbing etc

Available for the materials:
All kinds of resin materials used in Electronic and Optical fiels, Quartz, Glass, Ceramic, Yag, Sapphire, Agate, Granite, Marble etc

Features:
Ultra Precision: Size precision can reach 0.002mm
High Rigity: Good rigidity prevent the operation from slant and vibration
Long life Time: New technology keeps the discs's long life
Usage in Group: 10 or 12 in group makes high efficient operation

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