Gold Member Since 2006
Audited Supplier
Taizhou Sumeng Grinding Wheel Co., Ltd.

Abrasives, Grinding Wheel, Diamond Blades manufacturer / supplier in China, offering Diamond Dicing Blades, 1A1r, 14A1, 14f1 Diamond and CBN Grinding Wheel, CBN and Diamond Grinding Wheels, Superabrasives and so on.

(/ )

Supplier Homepage Product Dicing Blades Diamond Dicing Blades

Diamond Dicing Blades

FOB Price: US $80 / Piece
Min. Order: 100 Pieces
Min. Order FOB Price
100 Pieces US $80/ Piece
Get Latest Price
Production Capacity: 20 Million Pieces/ Month
Payment Terms: T/T, Western Union

Request a custom order and have something just for you!

Send Customized Request
Basic Info
  • Model NO.: 1A1R, 1A8
  • Origin: Jiangsu China
  • HS Code: 68042210
Product Description
Diamond dicing blades for silicon wafer, ultra thin and precision, more rigidity, accuracy, prevent the operation from slant and vibration

Resin or Metal bond ultra-thin diamond and CBN cut-off wheels use various resin or metal powders as the bond which are with different features for different purpose.

Metal bond wheels has an excellent resistance to high temperatures and deterioration, and excellent heat dissipation. It also features the highest abrasive grain holding power of all grinding wheels and has a long life.

The metal diamond wheel is mostly used for grinding glass, ceramics and other non-ferrous metals, and is also used for precision grinding utilizing its high conductivity.

Nickel-bond Dicing Blades
The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as: PCB, Silicon and BGA
Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size)
Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness)

Resin-bond Dicing Blades

Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)
Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness).

Metal-bond (Sintered) Dicing Blades

With slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as: BGA, Soft Alumina, TiC, LTCC and Ferrite
Blade thickness varies from 3 mil to 60 mil (depending on diamond grit size)
Diamond grit size ranges from 2 microns to 70 microns (depending on blade thickness)
Send your message to this supplier
Mr. Zhou Rong Ping
To: Mr. Zhou Rong Ping

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now