Diamond dicing blades for silicon wafer, ultra thin and precision, more rigidity, accuracy, prevent the operation from slant and vibration
Resin or Metal bond ultra-thin diamond and CBN cut-off wheels use various resin or metal powders as the bond which are with different features for different purpose.
Metal bond wheels has an excellent resistance to high temperatures and deterioration, and excellent heat dissipation. It also features the highest abrasive grain holding power of all grinding wheels and has a long life.
The metal diamond wheel is mostly used for grinding glass, ceramics and other non-ferrous metals, and is also used for precision grinding utilizing its high conductivity.
Nickel-bond Dicing Blades
The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as: PCB, Silicon and BGA
Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size)
Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness)
Resin-bond Dicing Blades
Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)
Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness).
Metal-bond (Sintered) Dicing Blades
With slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as: BGA, Soft Alumina, TiC, LTCC and Ferrite
Blade thickness varies from 3 mil to 60 mil (depending on diamond grit size)
Diamond grit size ranges from 2 microns to 70 microns (depending on blade thickness)
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