Diamond Blades with Cores

Product Details
Customization: Available
Manufacturing Technology: Discrete Device
Material: Element Semiconductor
Gold Member Since 2006

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Registered Capital
8000000 RMB
Plant Area
>2000 square meters
  • Diamond Blades with Cores
  • Diamond Blades with Cores
  • Diamond Blades with Cores
  • Diamond Blades with Cores
  • Diamond Blades with Cores
  • Diamond Blades with Cores
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Basic Info.

Model NO.
1A1R 1A1, 1A8
Package
PGA(Pin Grid Array Package)
Signal Processing
Analog Digital Composite and Function
Application
Temperature Measurement
Model
PC817
Batch Number
2005+
Trademark
SAIL
Origin
Suzhou
HS Code
6804221000

Product Description

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor.
Diamond Blades with CoresDiamond Blades with CoresDiamond Blades with CoresDiamond Blades with CoresDiamond Blades with Cores
The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor.

Also the products are used for the precision processing of hard and fragile materials, such as quartz, glass, ceramics, etc.

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