Wafer Back & Front Wheels

Product Details
Customization: Available
Manufacturing Technology: Optoelectronic Semiconductor
Material: Element Semiconductor
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Registered Capital
8000000 RMB
Plant Area
>2000 square meters
  • Wafer Back & Front Wheels
  • Wafer Back & Front Wheels
  • Wafer Back & Front Wheels
  • Wafer Back & Front Wheels
  • Wafer Back & Front Wheels
  • Wafer Back & Front Wheels
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Basic Info.

Model NO.
1A1
Type
Intrinsic Semiconductor
Package
SMD
Signal Processing
Analog Digital Composite and Function
Application
Temperature Measurement
Model
ST
Batch Number
2007+
Brand
EPSON
Trademark
SAIL
Origin
Suzhou
HS Code
6804221000

Product Description

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor.
Wafer Back & Front WheelsWafer Back & Front WheelsWafer Back & Front WheelsWafer Back & Front WheelsWafer Back & Front WheelsWafer Back & Front Wheels
The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor.

Also the products are used for the precision processing of hard and fragile materials, such as quartz, glass, ceramics, etc.

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