Wafer Back & Front Wheels

Taizhou Sumeng Grinding Wheel Co., Ltd.

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Product Attributes

Manufacturing Technology: Optoelectronic Semiconductor
Material: Element Semiconductor
Type: Intrinsic Semiconductor
Model NO.: 1A1
Package: SMD
Signal Processing: Analog Digital Composite and Function
Application: Temperature Measurement
Model: ST
Batch Number: 2007+
Brand: EPSON
Trademark: SAIL
Origin: Suzhou
HS Code: 6804221000

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Product Description

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor.
Wafer Back & Front Wheels

The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor.

Also the products are used for the precision processing of hard and fragile materials, such as quartz, glass, ceramics, etc.

About the Supplier

Company Profile

Taizhou Sumeng Grinding Wheel Co., Ltd. (including Jiangsu Subei Grinding Wheel Factory Co. Ltd, Bondflex Abrasives Co Ltd, SUZHOU SAILI PRECISION TOOLS CO Ltd) is leading factory specialized in manufacturing bonded abrasive products and Superabrasives tool, large O. D. Reinforced Cutting Wheels, Crankshaft Grinding Wheels, Cutting and Grinding Discs, Diamond & CBN Wheels, TCT Saw Blades, Diamond Tools etc.

We specialize in the research, develop and production of resinoid, vitrified and electroplated diamond & CBN wheels. These products are used in the fields of tools, mould & Die, bearing, Compressor, Automobile, Aerospace, Ceramic and Magnetic materials and IT.

We are largest manufacturer of diamond and CBN wheels in China with production capacity of 50, 000 pieces each month. Our top customers including Panasonic, Mitsubishi, Hitachi, Kennemetal, NSK, Guhring, Wangxiang, NMB etc. We are also excellent supplier of Panasonic and Mitsubishi.

We are making wheels for Aero-space alloy grinding, Cold saw grinding, TCT tipped saw grinding. Profile grindin, Carbide grinding, end mill grinding. Electro-chemical cut off and Electro-chemical surface grinding. The oil and gas industry, for grinding HVOF coatings, Thermal Spray coatings, Glass cutting, composite cutting, tool grinding, Ceramic grinding, PCB, PCBN, Slicing and dicing circuit boards, Silicon wafer cutting. Gem stone grinding, Grinding HSS, Tool steel grinding

We specialize in the production of Brown Aluminum Oxide, Pink Aluminum Oxide, Green Silicon Carbide, large O. D. Reinforced Cutting Wheels, Billet Grinding Wheel, Crankshaft Grinding Wheels, Grinding wheels, Cutting wheels, Diamond wheel and CBN wheels etc abrasives products.

We are the Vice Chairman of Abrasive Product Association of China Machine Tool & Tool Builders' Association (CMTBA), State Second-grade Enterprise, Jiangsu Innovative Enterprise, Jiangsu High-tech Enterprise, and Jiangsu Intellectual Property Demonstration Enterprise. The Group's company has participated in the compiling of several National and Industry Standards of Abrasive Industry. The company has over 60 years experiences in abrasive manufacturing.

About Our Factory & Business Background

Address: 128 Renmin North Road, Jiangyan, Jiangsu, China
Terms of Payment: LC, T/T, D/P, PayPal, Western Union, Money Gram
International Commercial Terms(Incoterms): FOB, EXW, CIF, DDP, DAP, CIP, FCA
Average Lead Time: Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Nearest Port: Our top customers including Panasonic, Mitsubishi, Hitachi, Kennemetal, NSK, Guh

Our Production Capability & Technical Expertise

Main Products: Abrasives, Grinding Wheel, Diamond Wheel, Cut-off Wheel, Diamond Tool, CBN Wheel, Superabrasive, Cutting Wheel, Dicing Blade, Borazon Wheel

Our Industry Experience & Global Business Record

Export Year: 1996-09-08
Main Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe